All abrasive grains used at AWUKO are synthetically produced in high-temperature vessels and, by crushing and screening processes, cassified into grain size Groups ranging from very coarse to superfine. All grains used at AWUKO conform to the FEPA standard. The field of application determines the type of grain that is electrostatically applied on the base, i.e. grains made of corundum (aluminium oxide), zirconia alumina, and silicon carbide come into use. The grain coating varies from dense to open.
Classification of grain types according to FEPA Standard:
P2000, -P1500, -P1200, -P1000, -P800, -P600, -P500, -P400, -P360, -P320, -P280, -P240, -P220, -P180, -P150, -P120, -P100, -P80, -P60, -P50, -P40, -P36, -P30, -P24, -P20, -P16, -P12
Bond material: Synthetic resin and hide glue
The fully hardened synthetic resin bond which results from the chemical composition allows for a high degree of heat resistance and operational demands during machine use without causing any distortions to the structure of the sanding surface.
AWUKOs handling with raw materials
Hide glue becomes soft and dissolves when exposed to very high temperatures. Despite this fact, hide glue bond sanding media are yet the preferred choice as they provide for a softer and neater finish under manual and low-torque conditions.
The storage temperature for sanding media is around 15-20° C with humidity at 50-60 %.